Equipotential Bonding; Instruction For Use - Weller WDD 81V Manual De Uso

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4. Equipotential bonding

The various circuit elements of the 3.5 mm jack bush (7)
make 4 variations possible:
Hard-grounded:
No plug (delivery form)
Equipotential bonding:
With
contact(impedance 0 ohms
Potential free:
With plug
Soft-grounded:
With plug and soldered resistance.
Grounding via set resistance value.

5. Instruction for Use

Different suction nozzles provide solutions for a wide range
of desoldering problems.
The correct tool for changing the suction nozzles is integra-
ted in the cleaning tool. Press lightly against the heating ele-
ment when inserting and locking the suction nozzles.
It is important to use additional solder when desoldering. This
ensures good suction nozzle wetting properties and improves
the flow characteristics of the old solder. Ensure that the suc-
tion nozzle is perpendicular to the plane of the circuit board
to achieve optimal suction performance. The solder must be
completely molten. During the desoldering process it is
important to move the component pin in a circular motion in
the hole. If, after the desoldering process, the solder is not
completely removed, the solder joint should be retinned
before desoldering again. The selection of the right size of
suction nozzle is important. As a rule of thumb: the internal
diameter of the suction nozzle should match the diameter of
the hole in the circuit board.
When heating the suction nozzle or soldering iron bit for the
first time, wet with solder. This removes oxide layers and
impurities that have formed during storage. Always ensure
that the soldering iron bit or suction nozzle is well tinned
during breaks in soldering and when placing in the holder. Do
not use excessively aggressive fluxes.
The desoldering station has been set up for a medium size
suction nozzle or soldering iron bit. Temperature variations
may occur if other bit shapes are used.
Important: Always ensure that the soldering iron bit is
correctly seated.
19
plug, equalizer at
External input unit WCB 1 and WCB 2 (optional)
The following functions are possible when using an external
input unit.
● Offset:
The real temperature of the soldering iron can be changed by
± 40°C (72°F) by input of a temperature offset.
● Setback:
center
Reduction of the required temperature set to 150ºC / 300ºF
(standby). The set-back time, the time after which the solde-
ring station switches into standby mode, can be adjusted
from 0-99 minutes. The set-back condition is indicated by a
flashing actual value display. After a period equal to three
times the set-back time, „Auto-Off" is activated. The solde-
ring iron is switched off (flashing dash on the display). The
set-back or auto-off condition is ended by pressing a button
or finger switch pressure. During this process the required
value set is briefly displayed.
● Lock:
Locking the setpoint temperature. Settings cannot be chan-
ged after the soldering station has been locked.
● °C/°F:
Switching the temperature display from °C to °F, and vice
versa.
● Window:
Limitation of the temperature range to max. ±99 °C based on
a locked temperature resulting from the "LOCK" function.
The locked temperature represents the median point of the
adjustable temperature range. For units with a floating con-
tact (optocoupler output) the "WINDOW" function is used to
adjust a temperature window. If the actual temperature is
within the temperature window the floating contact will be
enabled (optocoupler output).
● Cal:
Re-adjustment of the soldering station (WCB 2 only).
● PC interface:
RS232 (WCB 2 only).
● Temp. gauge:
Integrated temperature gauge for thermal element Type K
(WCB 2 only).