ASROCK H670 PG Riptide Manual De Instrucciones página 9

1.2 Specifications
Platform
CPU
Chipset
Memory
Expansion
Slot
Graphics
6
• ATX Form Factor
• Solid Capacitor design
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• Supports 12 Gen Intel® Core
• 9 Power Phase design
• Supports Intel® Hybrid Technology
• Supports Intel® Turbo Boost Max 3.0 Technology
• Intel® H670
• Dual Channel DDR4 Memory Technology
• 4 x DDR4 DIMM Slots
• Supports DDR4 non-ECC, un-buffered memory up to
5000+(OC)*
* Supports DDR4 3200 natively.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
• Supports ECC UDIMM memory modules (operate in non-
ECC mode)
• Max. capacity of system memory: 128GB
• Supports Intel® Extreme Memory Profile (XMP) 2.0
• 2 x PCIe x16 Slots (PCIE1/PCIE3: single at Gen5x16 (PCIE1);
dual at Gen5x16 (PCIE1) / Gen4x4 (PCIE3))*
* Supports NVMe SSD as boot disks
• 3 x PCIe Gen3x1 Slots
• Supports AMD CrossFire
• 1 x M.2 Socket (Key E), supports type 2230 WiFi/BT PCIe
WiFi module and Intel® CNVi (Integrated WiFi/BT)
• Intel® UHD Graphics Built-in Visuals and the VGA outputs
can be supported only with processors which are GPU
integrated.
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• Intel® X Graphics Architecture (Gen 12)
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Processors (LGA1700)
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