ASROCK B550M Pro4 Manual Del Usuario página 8

1.2 Specifications
Platform
CPU
Chipset
Memory
Expansion
Slot
6
• Micro ATX Form Factor
• Solid Capacitor design
• 2oz Copper PCB
rd
• Supports 3 Gen AMD AM4 Ryzen™ / future AMD Ryzen™
Processors (3000 and 4000 Series Processors)*
* Not compatible with AMD Ryzen™ 5 3400G and Ryzen™ 3
3200G.
• Digi Power design
• 8 Power Phase design
• AMD B550
• Dual Channel DDR4 Memory Technology
• 4 x DDR4 DIMM Slots
• AMD Ryzen series CPUs (Matisse) support DDR4
4533+(OC)/4466(OC)/4400(OC)/4333(OC)/4266(OC)/
4200(OC)/4133(OC)/4000(OC)/3866(OC)/3800(OC)/3733
(OC)/3600(OC)/3466(OC)/3200/2933/2667/2400/2133 ECC
& non-ECC, un-buffered memory*
• AMD Ryzen series APUs (Renoir) support DDR4 4733+
(OC)/4666(OC)/4600(OC)/4533(OC)/4466(OC)/
4400(OC)/4333(OC)/4266(OC)/4200(OC)/4133(OC)/
4000(OC)/3866(OC)/3800(OC)/3733(OC)/3600(OC)/
3466(OC)/3200/2933/2667/2400/2133 ECC & non-ECC, un-
buffered memory*
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
* Please refer to page 22 for DDR4 UDIMM maximum
frequency support.
• Max. capacity of system memory: 128GB
• Supports Extreme Memory Profile (XMP) memory modules
• 15μ Gold Contact in DIMM Slots
AMD Ryzen series CPUs (Matisse)
• 2 x PCI Express x16 Slots (PCIE1: Gen4x16 mode; PCIE3:
Gen3 x4 mode)*
AMD Ryzen series APUs (Renoir)
• 2 x PCI Express x16 Slots (PCIE1: Gen3x16 mode; PCIE3:
Gen3 x4 mode)*