Chipset; Processors - Dell OptiPlex 7080 Micro Guía De Configuración Y Especificaciones

Chipset

Tabla 3. Chipset
Descripción
Chipset
Procesador
Amplitud del bus de DRAM
EPROM flash
bus de PCIE
Memoria no volátil
Interfaz periférica de serie (SPI) de configuración del BIOS
Módulo de plataforma segura (TPM discreto habilitado)
TPM de firmware (TPM discreto deshabilitado)
EEPROM NIC

Processors

NOTE: Global Standard Products (GSP) are a subset of Dell's relationship products that are managed for availability and
synchronized transitions on a worldwide basis. They ensure the same platform is available for purchase globally. This allows customers
to reduce the number of configurations managed on a worldwide basis, thereby reducing their costs. They also enable companies to
implement global IT standards by locking in specific product configurations worldwide.
Device Guard (DG) and Credential Guard (CG) are the new security features that are only available on Windows 10 Enterprise today.
Device Guard is a combination of enterprise-related hardware and software security features that, when configured together, will lock a
device down so that it can only run trusted applications. If it is not a trusted application, it cannot run.
Credential Guard uses virtualization-based security to isolate secrets (credentials) so that only privileged system software can access
them. Unauthorized access to these secrets can lead to credential theft attacks. Credential Guard prevents these attacks by protecting
NTLM password hashes and Kerberos Ticket Granting Tickets.
NOTE: Processor numbers are not a measure of performance. Processor availability is subject to change and may vary by region/
country.
Table 4. Processors
Processors Wattage
th
10 35 W
Generation
Intel Core
i3-10100T
th
10 35 W
Generation
Intel Core
i3-10300T
Core Thre Speed
count ad
coun
t
4 8 3.0 GHz to 3.8
GHz
4 8 3.0 GHz to 3.9
GHz
Valores
Intel Q470
th
10 Generation Intel Core i3/i5/i7/i9
64-bit (for single channel)
32 MB
Up to Gen 3.0
Sí
256 Mbits (32 MB), ubicado en SPI_FLASH en el chipset
24 KB ubicado en el TPM 2.0 en el chipset
De manera predeterminada, la función de tecnología de confianza
de la plataforma es visible para el sistema operativo
Configuración de LOM contenida en la ROM Flash de SPI en lugar
de en el e-fuse del LOM
Cache Integrated graphics
6 MB Intel UHD Graphics 630
8 MB Intel UHD Graphics 630
GSP DG/CG
Ready
No Yes
No Yes
Especificaciones técnicas 17