General Memory Module Installation Guidelines; Pautas Específicas De Los Modos; Código De Corrección De Errores Avanzado (Lockstep) - Dell PowerEdge M630 Manual Del Propietário

canal 2: sockets de memoria B3, B7 y B11
canal 3: sockets de memoria B4, B8 y B12

General memory module installation guidelines

Your system supports Flexible Memory Configuration, enabling the system to be configured and run in any valid chipset architectural
configuration. The following are the recommended guidelines for best performance:
• LRDIMMs, and RDIMMs must not be mixed.
• x4 and x8 DRAM based DIMMs can be mixed. For more information, see the Mode-specific guidelines section.
• A maximum of three single-rank or dual-rank RDIMMs can be populated in a channel.
• Up to three LRDIMMs can be populated regardless of rank count.
• Populate DIMM sockets only if a processor is installed. For single-processor systems, sockets A1 to A12 are available. For dual-
processor systems, sockets A1 to A12 and sockets B1 to B12 are available.
• Populate all sockets with white release tabs first, black, and then green.
• Populate the sockets by highest capacity DIMM in the following order - first in sockets with white release levers and then black. For
example, if you want to mix 16 GB and 8 GB DIMMs, populate 16 GB DIMMs in the sockets with white release tabs and 8 GB DIMMs in
the sockets with black release tabs.
• In a dual-processor configuration, the memory configuration for each processor must be identical. For example, if you populate socket
A1 for processor 1, then populate socket B1 for processor 2, and so on.
• Memory modules of different sizes can be mixed provided that other memory population rules are followed (for example, 4 GB and 8
GB memory modules can be mixed).
• Depending on mode-specific guidelines, populate four DIMMs per processor (one DIMM per channel) at a time to maximize
performance. For more information, see the Mode-specific guidelines section.
Table 22. Heat sink — processor configurations
Processor Processor Type (in Watts)
Configuration
Single processor 105 W, 120 W or 135 W
Single processor 135 W (four cores, six cores,
or eight cores) or 145 W
NOTE: When using an 86 mm wide heat sink for a single processor, the memory module sockets A10 and A12 are not
available for population.
Dual processor 105 W, 120 W or 135 W
Dual processor 135 W (four cores, six cores,
or eight cores) or 145 W
Related reference
Pautas específicas de los modos
Pautas específicas de los modos
Cada procesador tiene asignados cuatro canales de memoria. Las configuraciones posibles dependen del modo de memoria seleccionado.
Código de corrección de errores avanzado (lockstep)
El modo de código de corrección de errores (ECC) avanzado extiende el SDDC desde x4 DRAM basadas en DIMM a DRAM x4 y x8. Esta
ampliación supone protección ante errores de chip DRAM sencillos durante el funcionamiento.
Las pautas de instalación para los módulos de memoria son las siguientes:
• Todos los módulos de memoria deben ser idénticos en lo que se refiere a tamaño, velocidad y tecnología.
Heat
Sink
Maximum System Capacity
Width
68 mm 12
86 mm 10 (Three DIMMs in channel 0
and channel 2 and two DIMMs
in channel 1 and channel 3)
68 mm 24
86 mm 20 (Three DIMMs in channel 0
and channel 2 and two DIMMs
in channel 1 and channel 3)
Instalación y extracción de componentes del módulo de alta densidad
Number of DIMMs
Reliability, Availability, and
Serviceability (RAS) Features
12
8 (Two DIMMs per channel)
24
16 (Two DIMMs per channel)
65