1.2 Specifications
Platform
CPU
Chipset
Memory
Expansion
Slot
Graphics
6
• Micro ATX Form Factor
• 2oz Copper PCB
th
• Supports 12
Gen Intel® Core
• Digi Power design
• 9 Power Phase design
• Supports Intel® Hybrid Technology
• Supports Intel® Turbo Boost Max 3.0 Technology
• Intel® B660
• Dual Channel DDR4 Memory Technology
• 4 x DDR4 DIMM Slots
• Supports DDR4 non-ECC, un-buffered memory up to
5000+(OC)*
* Supports DDR4 3200 natively.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
• Supports ECC UDIMM memory modules (operate in non-
ECC mode)
• Max. capacity of system memory: 128GB
• Supports Intel® Extreme Memory Profile (XMP) 2.0
• 15μ Gold Contact in DIMM Slots
• 1 x PCIe Gen5x16 Slot*
* Supports NVMe SSD as boot disks
• 2 x PCIe Gen3x1 Slots
• 1 x M.2 Socket (Key E), supports type 2230 WiFi/BT PCIe
WiFi module and Intel® CNVi (Integrated WiFi/BT)
• 15μ Gold Contact in VGA PCIe Slot (PCIE1)
• Intel® UHD Graphics Built-in Visuals and the VGA outputs
can be supported only with processors which are GPU
integrated.
e
• Intel® X
Graphics Architecture (Gen 12)
• Dual graphics output: support HDMI and DisplayPort 1.4
ports by independent display controllers
TM
Processors (LGA1700)