1.2 Speciications
• Micro ATX Form Factor
Platform
• Solid Capacitor design
• High Density Glass Fabric PCB
• Supports New 4
CPU
• Digi Power design
• 4 Power Phase design
• Supports Intel® Turbo Boost 2.0 Technology
• Intel® H81
Chipset
• Dual Channel DDR3 Memory Technology
Memory
• 2 x DDR3 DIMM Slots
• Supports DDR3 1600/1333/1066 non-ECC, un-bufered
• Max. capacity of system memory: 16GB (see CAUTION)
• Supports Intel® Extreme Memory Proile (XMP) 1.3 / 1.2
• 15μ Gold Contact in DIMM Slots
• 1 x PCI Express 2.0 x16 Slot (PCIE1: x16 mode)
Expansion
• 3 x PCI Express 2.0 x1 Slots
Slot
• 15μ Gold Contact in VGA PCIe Slot (PCIE1)
• Intel® HD Graphics Built-in Visuals and the VGA outputs can
Graphics
• Supports Intel® HD Graphics Built-in Visuals : Intel® Quick
• Pixel Shader 5.0, DirectX 11.1
• Max. shared memory 1792MB
• Dual graphics output: support DVI-D and D-Sub by
• Supports DVI-D with max. resolution up to 1920x1200 @
th
th
and 4
Xeon®/Pentium®/Celeron® Processors (Socket 1150)
memory
be supported only with processors which are GPU integrated.
Sync Video with AVC, MVC (S3D) and MPEG-2 Full
HW Encode1, Intel® InTru
Technology, Intel® Insider
independent display controllers
60Hz
TM
Generation Intel® Core
TM
3D, Intel® Clear Video HD
TM
, Intel® HD Graphics 4400/4600
H81M-G
i7/i5/i3/
5