ASROCK X99 WS Manual Del Usuario página 9

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1.2 Speciications
• EATX Form Factor
Platform
• 2oz Copper PCB
• High Density Glass Fabric PCB
• Supports Intel® Core
CPU
• Digi Power design
• 12 Power Phase design
• Supports Intel® Turbo Boost 2.0 Technology
• Supports Untied Overclocking Technology
• Intel® X99
Chipset
• Quad Channel DDR4 Memory Technology
Memory
• 8 x DDR4 DIMM Slots
• Supports DDR4 3000+(OC)*/2933+(OC)/2800(OC)/2400
* Please refer to Memory Support List on ASRock's website for
• Supports non-ECC RDIMM (Registered DIMM)
• Supports DDR4 ECC, un-bufered memory/RDIMM with
• Max. capacity of system memory: 128GB (see CAUTION)
• Supports Intel® Extreme Memory Proile (XMP) 2.0
• 15μ Gold Contact in DIMM Slots
• 5 x PCI Express 3.0 x16 Slots (PCIE1/PCIE2/PCIE3/PCIE4/
Expansion
Slot
* If you install CPU with 28 lanes, PCIE1/PCIE2/PCIE3/PCIE4
will run at x16/x0/x4/x8 or x8/x8/x4/x8, and PCIE6 will be
disabled.
* If M.2 PCI Express module is installed, PCIE3 slot will be
• 1 x PCI Express 2.0 x16 slot (PCIE5: x4 mode)
TM
Processor Family for the LGA 2011-3 Socket, up to 18 Cores
and 160W
(OC)/2133/1866/1600/1333/1066 non-ECC, un-bufered
memory
more information. (http://www.asrock.com/)
Intel® Xeon® processors E5 series in the LGA 2011-3 Socket
PCIE6: single at x16 (PCIE1); dual at x16 (PCIE1) / x16
(PCIE4); triple at x8 (PCIE1) / x8 (PCIE2) / x16 (PCIE4);
quad at x8 (PCIE1) / x8 (PCIE2) / x8 (PCIE4) / x8 (PCIE6))
disabled.
i7 and Xeon® E5-1600/2600 v3
X99 WS
7

Capítulos

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